| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to fundamentally prevent the generation of voids due to the insertion of a semiconductor chip by surrounding the semiconductor chip using sealant. CONSTITUTION: A semiconductor chip(150a) and a second semiconductor(150b) are prepared. A first dielectric layer(102) and a second dielectric layer(104) surround each semiconductor chip and in contact with each other. A first circuit wiring(122) and a second circuit wiring(124) are formed on the upper side of the dielectric layers. The circuit wirings are in connection with via-electrodes passing through the dielectric layers. A first insulating layer(152) and a second insulating layer(154) cover the upper side of the circuit wirings. |
