| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a device with components built-in substrate having components built-in that need space of a suitable size below or above the components.SOLUTION: Prepreg 41 as sealing resin is pressure-bonded onto a core substrate 2 so as to cover components 3a and 3b with a resin film 8 between, but the prepreg 41 is held so as to be prevented from entering the substrate side beyond the resin film 8. Furthermore, after the prepreg 41 is separated from the core substrate 2, and the resin film 8 is removed from the separated prepreg 41, the prepreg 41 is pressure-bonded and cured on the core substrate 2 so as to cover the components 3a and 3b and to surely form a hollow part (space) α, at least below the components 3a and 3b, and the components built-in substrate device 1A is formed. |
