LAMINATED SUBSTRATE HAVING CAVITY STRUCTURE, MANUFACTURING METHOD FOR THE SAME, CIRCUIT MODULE USING THE LAMINATED SUBSTRATE, AND MANUFACTURING METHOD FOR THE CIRCUIT MODULE

摘要

PROBLEM TO BE SOLVED: To provide a circuit board which enables vertical mounting and can be manufactured easily.SOLUTION: The circuit board includes a laminated substrate 10 including a plurality of insulating layers 10a to 10h between which an internal conductive layer 21 is formed, a surface conductive layer 22 formed on the surface of the laminated substrate 10 and connected electrically to the internal conductive layer 21, and a cavity formed by selectively eliminating at least one of the insulating layers 10a to 10h of the laminated substrate 10. At least two of the insulating layers 10a to 10h project from a plane perpendicular to the direction of lamination of the laminated substrate 10 to form leg portions opposite to each other across a space. The surface conductive layer 22 extends to reach a projected end face of the insulating layers 10a to 10h to make up an external connection terminal 23.