SULFURIC ACID BASE COPPER PLATING LIQUID FOR SEMI-ADDITIVE AND METHOD FOR PRODUCING PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a sulfuric acid base copper plating liquid for a semi-additive which can produce wiring in which the surface of the cross-section in the width direction is made flat as wiring of an ultrafine pitch by a semi-additive process, and to provide a method for producing a printed circuit board using the same.SOLUTION: The sulfuric acid base copper plating liquid for a semi-additive comprises at least one kind selected from 3-mercapto-1-propanesulfonic acid and bis(3-sulfopropyl) disulfide, a quaternary ammonium salt polymer with a cyclic structure and chlorine, and has a copper concentration of 23 to 55 g/L and a sulfuric acid concentration of 50 to 250 g/L.