| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate dividing device capable of dividing a substrate and a frame section that holds the substrate while minimizing scattering of cutting chips.SOLUTION: The substrate dividing device 1 includes: an elastic member 20 independently and respectively holding the substrate 10 at a substrate section 11 and a frame section 12, the substrate 10 including a substrate section 11 in which electronic components are mounted, a frame section 12 surrounding the substrate section 11, and a rib 13 connecting the substrate section 11 and the frame section 12; a base member 30 holding the elastic member 20; a rotary drive section 50 rotating a router bit 51 for removing the ribs 13; a rotary controlling section 60 controlling the rotary drive section 50; a moving means 70 successively moving the router bit 51 together with the rotary drive section 50 to a plurality of positions; movement controlling section 80 controlling the moving means 70; and a dust collection section 90 sucking the substrate section 11 and cutting chips generated during removal of the ribs 13. |
