发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, FILM FOR PHOTOSENSITIVE RESIN SPACER, AND SEMICONDUCTOR DEVICE |
摘要 |
Disclosed is a photosensitive resin composition which is used as a photosensitive resin spacer for forming a cavity section between a substrate and a semiconductor element, including (A) an alkali-soluble resin, (B) a photopolymerizable resin, (C) a filler and (D) a photosensitizing agent, wherein the average particle diameter of said filler is in the range of 5 to 25 nm and the content of said filler is in the range of 1 to 15 weight %. Also disclosed is a film for a photosensitive resin spacer which is composed of the photosensitive resin composition described above.
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申请公布号 |
US2011008611(A1) |
申请公布日期 |
2011.01.13 |
申请号 |
US20090920208 |
申请日期 |
2009.03.16 |
申请人 |
SUMITOMO BAKELITE CO., LTD. |
发明人 |
SHIRAISHI FUMIHIRO;TAKAHASHI TOYOSEI |
分类号 |
B32B5/16;G03F7/004 |
主分类号 |
B32B5/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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