发明名称 |
Proximity Head Heating Method and Apparatus |
摘要 |
Provided is an apparatus and a method for heating fluid in a proximity head. A method for semiconductor wafer processing, includes providing liquid to a proximity head including a heating portion, heating the liquid within the heating portion of the proximity head and delivering the heated liquid to a surface of a semiconductor wafer for use in a wafer processing operation including forming a meniscus between the proximity head and the surface of the semiconductor wafer. |
申请公布号 |
US2011008916(A1) |
申请公布日期 |
2011.01.13 |
申请号 |
US20100886278 |
申请日期 |
2010.09.20 |
申请人 |
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发明人 |
MIKHAYLICHENKO KATRINA;DELARIOS JOHN |
分类号 |
B05C5/00;H01L21/66;B05D1/18;B08B3/00;B08B3/02;B08B3/04;C23C18/16;C25D5/22;C25D7/12;C25D17/00;C25D21/02;H01L21/00;H01L21/304;H01L21/306 |
主分类号 |
B05C5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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