| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrical property-altering planar member with a solder element in an IC chip package.SOLUTION: A structure includes a solder element 102 for electrically coupling a substrate 104 of an integrated circuit (IC) chip package 106 and a printed circuit board (PCB) 108; and a first electrical property altering, substantially planar member 130C, 130P positioned between the solder element 102 and at least one of a landing pad 120C of the substrate 104 and a landing pad of the PCB 108. In another embodiment, the electrical property altering, planar member 130C, 130P can be applied to the solder element(s) 102 between the IC chip 110 and the package substrate. |
