| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a heat insulating material 10 for electronic parts which can be manufactured by extrusion molding in which a solvent is not used and production processes are reduced, and which is excellent in molding processing and also excellent in economical efficiency.SOLUTION: The heat insulating material for electronic parts is prepared by laminating a back surface layer, a foamed layer and a pressure-sensitive adhesive layer, in this order, wherein thermal conductivity at 25°C is 0.20 W/(m K) or less, a total thickness is 100 to 500 μm and the thickness of the pressure-sensitive adhesive layer occupies 2.0 to 40% of the total thickness, further, three layers of the back surface layer, foamed layer and pressure-sensitive adhesive layer are manufactured according to a multilayer coextrusion molding method, and the foaming is performed simultaneously with the film forming such that the foaming ratio of the foamed layer becomes 1.1 to 3.0 times. |
