发明名称 |
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE |
摘要 |
A method for manufacturing an electronic component module is performed such that a shield layer can be formed as a thin film and an electronic component can be effectively shielded. A collective substrate including a plurality of electronic component modules including a plurality of electronic components is batch-sealed with a resin. A cut section is formed from a top surface of the sealed resin to a position that reaches a grounding electrode arranged in the substrate at a boundary section of the electronic component module so as to expose the grounding electrode. A conductive paste is applied on side surfaces and the top surface. Then, a conductive thin film is formed by spin coating, and the electronic component module is cut.
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申请公布号 |
US2011006106(A1) |
申请公布日期 |
2011.01.13 |
申请号 |
US20100887542 |
申请日期 |
2010.09.22 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KANRYO KOICHI;KATSUBE AKIO;TANAKA AKIRA |
分类号 |
B23K31/02 |
主分类号 |
B23K31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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