FORMULATIONS AND METHOD FOR POST-CMP CLEANING

摘要

PURPOSE: Formulation and method for implementing a cleaning process after a chemical-mechanical polishing(CMP) process are provided to form copolymer containing sulfonic acid and acrylic acid by polymerizing 2-acryl amido-2methyl propanesulfonic acid monomer and acrylic acid. CONSTITUTION: Base and polymer are added to formulation for implementing a cleaning process after a CMP process in order to improve the performance of the cleaning process. The polymer is 2-acryl amido-2methyl propanesulfonic-acrylic acid copolymer. The concentration of the polymer is between 0.01 and 10wt% with respect to a cleaning composition. Chemical substance containing the polymer is used for eliminating residual materials.