| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that although interdiffusion between a plated film and an interior electrode is generated when heat treatment is carried out for enhancing the junction property between the plating film, which is to be an exterior electrode, and the interior electrode after forming the exterior electrode of a multilayer electronic component by directly plating on an end surface of a lamination body, junction property becomes insufficient, or continuity of the plating film is interfered if the interdiffusion has deficiency and excess.SOLUTION: In a method of manufacturing the multilayer electronic component, after a plating film 10, which is to be an exterior electrode 8, is directly formed on an end surface 6 of a lamination body 5, when heat treatment is carried out, the condition is set so that a distance A of an interdiffusion layer 11 from the end surface 6 of the lamination body 5 becomes 0.5 to 1.9 μm on an interior electrode 3 side. |
