发明名称 3D STERIC CIRCUIT BOARD, AND CIRCUIT MODULE USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a high-reliable 3D steric circuit board of a cavity structure, wherein the circuit board can be efficiently mounted without restriction of a wiring pattern even when a metal lid is used.SOLUTION: The 3D steric circuit board 10 including an insulating board 1 having a recessed part, a plurality of wiring patterns 11 formed on the recessed part 5 of the insulating board 1, and an engagement part 6 engaging with a metal lid 3 formed to seal a region surrounding the recessed part is structured such that, in the engagement part 6, a surface of at least one wiring pattern (grounding line) 11g out of the wiring patterns is formed high, and abuts on the metal lid 3.
申请公布号 JP2011009438(A) 申请公布日期 2011.01.13
申请号 JP20090151099 申请日期 2009.06.25
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 KOBAYASHI MITSURU
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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