SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

摘要

PURPOSE: A substrate for a semiconductor package and the semiconductor package including the same are provided to reduce cost required for manufacturing the substrate by forming a metal wiring containing a ball-land part and a bond-finger part at one side of a core layer. CONSTITUTION: A core layer(202) comprises one side(202a) and another side(202b) opposing the one side. A metal wiring layer(203) comprises a ball-land part(203a) formed on one side of the core layer and a bond-finger part(203b) formed on the lateral side of the core layer. The bond-finger part comprises an addition bond-finger formed to be expanded to another side of the core layer. A solder-mask layer(204) is formed on the upper side of the metal wiring layer in order to expose the bond-finger part and ball-land part of the metal wiring layer. An adhesive is formed on the solder-mask layer.