| 摘要 |
PURPOSE: A semiconductor package and a method for manufacturing the same are provided to prevent defects due to the warpage of a sub-substrate by forming a warpage preventive unit to the sub-substrate. CONSTITUTION: A semiconductor chip(200) comprises a semiconductor chip body(210), a bonding pad(220), and a bump(230). The bonding pad is arranged on the semiconductor chip body. A sub-substrate(100) comprises a substrate body(110), a signal wiring, a first ball-land pattern(140), and a second ball-land pattern(150). An underfill material(700) fills a spaced between the sub-substrate and the semiconductor chip.
|
