| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board correctly connecting an electrode of a semiconductor element and an element connection pad together through a solder by accurately recognizing a recognition mark by using an image recognizing device.SOLUTION: The wiring board has: an insulating substrate 1; a wiring conductor 2 comprising a conductor layer formed on the surface of the insulating substrate 1; an element connection pad 2a composed of a part of the wiring conductor 2 to which an electrode T of a semiconductor element S is electrically connected through a solder 8a; a solder resist layer 6 which is coated on the surface of the insulating substrate 1 and on the conductor layer, having a first opening 6a which allows the element connection pad 2a to be exposed, and a second opening 6c which allows a part of the conductor layer to be exposed as a recognition mark 7; and a solder 8a welded to the element connection pad 2a. The recognition mark 7 is positioned in a solid pattern connected electrically to the element connection pad 2a, and is electrically isolated from the solid pattern. |
