| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid processing apparatus or the like for removing a film from a surface of a substrate with the use of a new method.SOLUTION: In a liquid processing apparatus 3 for removing a first film and a second film from a substrate on which the second film is formed on the upper layer of the first film, a first chemical supply part 51 supplies the first chemical for dissolving the first film to the substrate W, a second chemical supply part 51 supplies a second chemical for reducing the strength of the second film, and a fluid supply part 52 serving also as an impact giving part gives a physical impact to the second film to break the second film and supplies a fluid for washing away fragments of the second film having been broken. A control unit 7 controls the respective parts such that, after the second chemical has been supplied and then the fluid has been supplied from the fluid supply part 52, the first chemical is supplied. |
