发明名称 |
LIGHT EMITTING ELEMENT MODULE AND MANUFACTURING METHOD THEREOF, AND BACKLIGHT APPARATUS |
摘要 |
The invention provides a light emitting element module with a high yield where a portion through which a substrate and a lens are bonded can be prevented from cracking and peeling due to thermal expansion. A light emitting element part equipped with a light emitting element and an optical lens for diffusing light from the light emitting element are provided on a substrate in the light emitting element module, where the lens is fixed to the substrate with an adhesive resin having a tensile breaking elongation of 50% or more. The lens also has a plurality of supports and is fixed to the substrate through these supports, so that stress in the portion where the substrate and the lens are bonded can be dispersed between the supports, and a layer in which air can circulate so as to release heat is provided between the substrate and the lens.
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申请公布号 |
US2011007493(A1) |
申请公布日期 |
2011.01.13 |
申请号 |
US20100832755 |
申请日期 |
2010.07.08 |
申请人 |
ISHIO TOSHIYA;TANAKA YASUHIKO |
发明人 |
ISHIO TOSHIYA;TANAKA YASUHIKO |
分类号 |
G02F1/13357;H01L33/48;H01L33/58 |
主分类号 |
G02F1/13357 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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