发明名称 RECONSTITUTED WAFER STACK PACKAGING WITH AFTER-APPLIED PAD EXTENSIONS
摘要 A stacked microelectronic unit is provided which can include a plurality of vertically stacked microelectronic elements (12, 12A) each having a front surface (117), contacts (22) exposed at the front surface, a rear surface (118) and edges (18, 20) extending between the front and rear surfaces. Traces (24) connected with the contacts may extend along the front surfaces towards edges of the microelectronic elements with the rear surface of at least one of the stacked microelectronic elements being adjacent to a top face (90) of the microelectronic unit. A plurality of conductors (66) may extend along edges of the microelectronic elements from the traces (24) to the top face (90). The conductors may be conductively connected with unit contacts (76) such that the unit contacts overlie the rear surface (118) of the at least one microelectronic element (12A) adjacent to the top face.
申请公布号 US2011006432(A1) 申请公布日期 2011.01.13
申请号 US20080670952 申请日期 2008.07.25
申请人 TESSERA, INC. 发明人 HABA BELGACEM;HUMPSTON GILES;OVRUTSKY DAVID;MIRKARIMI LAURA
分类号 H01L23/538;H01L21/50 主分类号 H01L23/538
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