Method of predicting viscosity behavior of thermosetting resin, simulation software, method of producing thermosetting resin, and underfill produced in the production method

摘要

A method of predicting viscosity behavior of a thermosetting resin is provided that is capable of predicting viscosity behavior of a thermosetting resin and void generation in the underfill is suppressed while good solder connection is obtained. The method includes: measuring a reaction rate and measuring viscosity behavior to measure a calorimetry peak and viscosity behavior of the thermosetting resin with three or more rates of temperature increase respectively; fitting a reaction rate to fit measurement data with each rate of temperature increase obtained by the measuring a reaction rate to a Kamal model formula to obtain fitting curves; fitting viscosity behavior to fit parameters in the Kamal model formula and the measurement data for each rate of temperature increase obtained by the measuring viscosity behavior to a Castro-Macosko model formula to obtain fitting curves; and calculating virtual viscosity behavior to calculate virtual viscosity behavior of the thermosetting resin at the arbitrary rate of temperature increase by simulation based on each fitting curve for each rate of temperature increase obtained by the fitting viscosity behavior.

主权项

1. A method of predicting viscosity behavior of a thermosetting resin to predict viscosity behavior of the thermosetting resin with an arbitrary rate of temperature increase, the method comprising:
preparing a thermosetting resin as an evaluation sample; measuring a reaction rate to measure a calorimetry peak of the thermosetting resin with three or more rates of temperature increase respectively; measuring viscosity behavior to measure viscosity behavior of the thermosetting resin with the three or more rates of temperature increase respectively; fitting a reaction rate to fit measurement data with each of the rates of temperature increase obtained by the measuring a reaction rate to a Kamal model formula, to obtain a fitting curve of calorimetry and time and a fitting curve of the calorimetry and a temperature of the thermosetting resin for each of the rates of temperature increase, and to calculate parameters in the Kamal model formula determined for a material of the thermosetting resin; fitting viscosity behavior to fit the parameters in the Kamal model formula calculated in the fitting a reaction rate and the measurement data for each of the rates of temperature increase obtained by the measuring viscosity behavior to a Castro-Macosko model formula, to obtain fitting a curve of viscosity and time and a fitting curve of viscosity and a temperature of the thermosetting resin for each of the rates of temperature increase, and to calculate a parameter in the Castro-Macosko model formula determined by the material of the thermosetting resin; and calculating virtual viscosity behavior to calculate virtual viscosity behavior of the thermosetting resin at the arbitrary rate of temperature increase by simulation based on each fitting curve for each of the rates of temperature increase obtained by the fitting viscosity behavior.