发明名称 ACF FILM BONDING SHEET AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A buffer sheet for the compression of an anisotropic conductive film(ACF) and the manufacturing method of the same are provided to reduce cost required for manufacturing processes by simplifying the processes. CONSTITUTION: A liquid type thermal conductive silicon composition containing a silane coupling agent is applied to form a thermal conductive silicon coating layer. The thermal conductive silicon coating layer is applied to both sides of a polyimide film. The surface of the thermal conductive silicon coating layer is embossed. The thermal conductive silicon composition contains 20 to 60 weight% of vinyl-based polymer, 0.1 to 30 weight% of silica, 30 to 70 weight% of thermal conductive filler, 0.1 to 5 weight% of hydroxyl siloxane, 0.001 to 0.1 weight% of retarder, 0.001 to 0.1 weight% of platinum catalyst, and 0.1 to 1.0 weight% of a silane coupling agent.
申请公布号 KR20110003747(A) 申请公布日期 2011.01.13
申请号 KR20090061174 申请日期 2009.07.06
申请人 HAE RYONG SILICONE CO., LTD. 发明人 RO, YONG HO;KANG, SOON MAN;KIM, CHUL KWON;LEE, BAE YOUNG
分类号 B32B27/34;H01B1/24 主分类号 B32B27/34
代理机构 代理人
主权项
地址