| 摘要 |
PURPOSE: An apparatus for inspecting a semiconductor chip is provided to improve both the flatness and the precision of the semiconductor chip by forming fine absorbent holes on the surface of an inspecting table. CONSTITUTION: A base(100) blocks vibrations generated from the outside. An elevating unit(200) is installed at one side of the base to be elevatable. An X-Y stage(300) moves to the X-axis and the Y-axis using a linear motor. An inspecting table(400) fixes a semiconductor chip by implementing vacuum absorption. A loading-unloading unit(500) loads the semiconductor chip to the inspecting table and unloads the semiconductor chip from the inspecting table.
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