| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate inspection method and device for performing inspection with high throughput and accuracy.SOLUTION: The substrate inspection method includes a bright field image acquisition step S1 in which illumination light is radiated around the edge of a wafer on the surface of which a resist film is formed, and the reflected light is imaged for acquiring a bright field image around the edge, a differential interference image acquisition step S2 in which the illumination light, which is split in two optical paths, is radiated around the edge of the wafer and the interference light where the reflected light from the wafer surface is synthesized with a reflected light from a resist film is imaged, to acquire a differential interference image around the edge, an edge position detecting step S11 for detecting a wafer border position based on the bright field image, a border position detecting step S12 for detecting EBR border position E based on the referential interference image, and a decision step S13 for determining a distance from the wafer border position to the EBR border position. |
