| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a solar cell, capable of executing uniform backside flattening even for a square semiconductor substrate by employing a simple apparatus configuration.SOLUTION: In a backside etching process for flattening a light-receiving surface of a semiconductor substrate and a backside opposite thereto by wet etching, an etching liquid out of a region where the semiconductor substrate is immersed in the etching liquid is sprayed to the backside while the semiconductor substrate is being immersed in the etching liquid with the light-receiving surface covered. |
