发明名称 RESONATOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To easily prevent an interfusion of foreign materials to a circumference of a vibrating member of a MEMS (Micro Electro Mechanical System) resonator using a torsional vibration mode.SOLUTION: A resonator package 101 includes: a base material 31 having a flat upper surface 31u; anchor parts 2a, 2b fixed to the upper surface 31u; a vibrating member 4 insulated from the upper surface 31u and extending in a beam shape; a surrounding underpart 45 for surrounding the circumference of the vibrating member 4; a surrounding upper part 46 formed by the same material and height as those of the vibrating member 4 and arranged so as to surround the circumference of the vibrating member 4; insulating film patterns 22d, 22e arranged on the upper surfaces of the anchor parts 2a, 2b and the surrounding underpart 45; a cap member 43 arranged on the upper side of the surrounding upper part 46, and completely covering the inside region while separated from the vibrating member 4; and an interconnection formed on the upper surface 31u. The interconnection pass through underside of the surrounding underpart 45 along the upper surface 31u and are extended up to the outside.
申请公布号 JP2011010216(A) 申请公布日期 2011.01.13
申请号 JP20090153992 申请日期 2009.06.29
申请人 SANYO ELECTRIC CO LTD;RITSUMEIKAN 发明人 SUZUKI KENICHIRO;TAMANO AKIMASA;OKADA MITSUHIRO;KYO MASAYA
分类号 H03H9/24;B81B3/00;B81C3/00;H03H3/007;H03H9/02 主分类号 H03H9/24
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