| 摘要 |
PROBLEM TO BE SOLVED: To provide an inspection system capable of highly accurately determining correlation between the distribution pattern of defects in a semiconductor wafer found in a defect inspection, and the distribution pattern in a defective semiconductor chip found in an electric test, in a short time.SOLUTION: The electric test is performed to a plurality of semiconductor chips of the semiconductor wafer. Presence/absence of a correlation is determined by checking first coordinate data of the defective semiconductor chip found in the electric test, and third coordinate data of the semiconductor chip obtained by statistically processing circuit characteristic values measured by changing a condition about the semiconductor chip. Presence/absence of a correlation is determined by checking the first coordinate data determined that there is no correlation with the third coordinate data, and second coordinate data of the defective semiconductor chip found in the defect inspection of the semiconductor chip. |
