HEAT RADIATING COMPONENT INTEGRATED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a heat radiating component integrated circuit board capable of thinning the thickness totally compared with a conventional art, and of obtaining a high heat radiation property over a long period of time.SOLUTION: This invention is related to a heat radiating component integrated circuit board. An insulating layer 2 is provided to a heat radiating component 1. A circuit 3 is provided and formed to the insulating layer 2.