| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module high in the heat dissipation of a supporting substrate.SOLUTION: The thermoelectric conversion module 9 includes the supporting substrate 1 formed of ceramic, a plurality of thermoelectric conversion elements 2 arranged on the supporting substrate 1 and a plurality of wiring conductors 3 formed on the supporting substrate 1 for electrically connecting the thermoelectric conversion elements 2 where metallic particles 10 dispersively exist in the supporting substrate 1. Thus, heat diffusion in the supporting substrate 1 is improved. Heat accumulated on an interface between the supporting substrate 1 and the wiring conductors 3 can be reduced. The softening of solder 6 for joining the thermoelectric conversion elements 2 with the wiring conductors 3 is inhibited, and the displacement of a position of the thermoelectric conversion elements 2 can be prevented. |
