发明名称 SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND IMPRINT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing method and an imprint device increasing the productivity.SOLUTION: In the substrate processing method, a first imprint process of transferring a pattern formed on a first template onto a resist 150 as a fluidized material disposed on a semiconductor substrate and at least one of a process of inspecting a second semiconductor substrate as an object of an imprint process different from the first imprint process, a process of applying a separating material 140 onto a surface of a pattern formed on a second template, and an inspecting/cleaning process of inspecting a third template used in an imprint process of transferring a pattern formed on the third template onto the resist 150 disposed on the semiconductor substrate which is performed before performing the first imprint process and cleaning the third template when the third template is decided to be reusable by inspection are performed in parallel in the same process chamber.
申请公布号 JP2011009250(A) 申请公布日期 2011.01.13
申请号 JP20090148199 申请日期 2009.06.23
申请人 TOSHIBA CORP 发明人 SUZUKI MASARU;KONO TAKUYA
分类号 H01L21/027;B29C33/72;B29C59/02 主分类号 H01L21/027
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