METHOD FOR FORMING INTEGRATED CIRCUIT STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a back interconnect structure of an integrated circuit and a method of manufacturing the same.SOLUTION: The method for forming the integrated circuit structure includes a step to provide a semiconductor wafer containing a first notch extending from an edge of the semiconductor into the inside of the semiconductor wafer, and a step to dispose a carrier wafer containing a second notch on the semiconductor wafer. In the step to dispose the carrier wafer, at least a part of the first notch is superposed on at least a part of the second notch.