| 摘要 |
PROBLEM TO BE SOLVED: To provide an acceleration sensor which can improve reliability around an electrode pad, by using a wafer-level package.SOLUTION: The acceleration sensor 100 includes: a sensor part 110 including an acceleration detecting element and aluminum wiring 116 for connecting electrode pads 115 (115a-115d) formed on a frame 111; a protective film 117 which is layered on a portion of the electrode pads 115 (115a-115d) and the aluminum wiring 116 formed on the frame 111; a cap part 118 which covers the sensor part 110 and brings the sensor part 110 to be housed in a sealed space; and an adhesive layer 119 which is layered on the protective film 117 to join the sensor part 110 and the cap part 118. |
