| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device easily manufacturable, and capable of contributing to reduction of manufacturing cost.SOLUTION: In this semiconductor 1, a semiconductor chip 3 is subjected to flip chip connection to a substrate 2 through bumps 4. The semiconductor device 1 includes a first sealing body 61 filled in a space between the substrate 2 and the semiconductor chip 3, and a second sealing body 62 covering the semiconductor chip 3. The second sealing body 62 has much inorganic filler content compared with the first sealing body 61. Since it is not necessary to separately arrange a member low in a thermal expansion coefficient in the space between the substrate 2 and the semiconductor chip 3, the manufacture of the semiconductor is easy, and the semiconductor device can contribute to the reduction of manufacturing cost thereof. |
