| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing method and apparatus, capable of uniformly forming a film on a wafer by inhibiting a jumping phenomenon of the wafer, preventing a decline in yield and productivity and improving the reliability of a semiconductor device.SOLUTION: The semiconductor manufacturing method includes: carrying a wafer into a reaction furnace; placing the wafer on a lifted push-up shaft; disposing an in-heater for heating the wafer so that a difference in temperature between the central part and the outer periphery of the wafer may be within a predetermined range and an out-heater for heating the outer periphery of the wafer, at a first position; heating up the wafer on the push-up shaft by the in-heater and out-heater; lowering the push-up shaft; holding the wafer on a holding member; disposing the in-heater and out-heater at a second position so that the temperatures of the central part and the outer periphery of the wafer may be substantially the same; heating the wafer on the holding member at a predetermined temperature; rotating the wafer; and supplying a process gas onto the wafer. |
