发明名称 |
STACK TYPE COOLING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a stack type cooling device in which a control circuit board is hardly influenced by electromagnetic noise caused by a semiconductor module.SOLUTION: The stack type cooling device is constituted by alternately stacking and arranging a semiconductor module 2 and a cooling tube 3. The control circuit board 4 which controls the operation of the semiconductor modules 2 is arranged adjacently to the stack of semiconductor modules 2 and cooling tubes 3 at an interval in a direction orthogonal to the stacking direction. A control signal terminal 21 is connected to the control circuit board 4. Then a noise blocking member 5 which blocks electromagnetic noise caused by a semiconductor module 2 is provided between the conductor module 2 and control circuit board 4. The noise blocking member 5 is united with the cooling tubes 3. |
申请公布号 |
JP2011009462(A) |
申请公布日期 |
2011.01.13 |
申请号 |
JP20090151377 |
申请日期 |
2009.06.25 |
申请人 |
DENSO CORP |
发明人 |
SUEKAWA DAISUKE;KIMURA MITSUNORI |
分类号 |
H01L23/473;H01L25/07;H01L25/18;H02M7/48 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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