发明名称 STACK TYPE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a stack type cooling device in which a control circuit board is hardly influenced by electromagnetic noise caused by a semiconductor module.SOLUTION: The stack type cooling device is constituted by alternately stacking and arranging a semiconductor module 2 and a cooling tube 3. The control circuit board 4 which controls the operation of the semiconductor modules 2 is arranged adjacently to the stack of semiconductor modules 2 and cooling tubes 3 at an interval in a direction orthogonal to the stacking direction. A control signal terminal 21 is connected to the control circuit board 4. Then a noise blocking member 5 which blocks electromagnetic noise caused by a semiconductor module 2 is provided between the conductor module 2 and control circuit board 4. The noise blocking member 5 is united with the cooling tubes 3.
申请公布号 JP2011009462(A) 申请公布日期 2011.01.13
申请号 JP20090151377 申请日期 2009.06.25
申请人 DENSO CORP 发明人 SUEKAWA DAISUKE;KIMURA MITSUNORI
分类号 H01L23/473;H01L25/07;H01L25/18;H02M7/48 主分类号 H01L23/473
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