| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor analyzing device capable of inspecting breaking of metal wiring.SOLUTION: The semiconductor analyzing device includes a power supply portion for applying a voltage to a semiconductor device to be inspected, a light source which emits a laser beam, an optical system which irradiates the semiconductor device with the laser beam while performing scanning, and a detection electrode installed at the semiconductor device across an insulating film. The detection electrode is capacitively coupled to wiring of the semiconductor device, and the fault part of the semiconductor device is analyzed on the basis of a signal which is obtained by irradiating the semiconductor device with the laser beam while performing the scanning and detected by the detection electrode. |
