SEMICONDUCTOR WAFER TREATING METHOD AND SEMICONDUCTOR WAFER DRYING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor wafer treating method and a semiconductor wafer drying device, satisfactorily processing a semiconductor wafer in a short period of time in a dry process after cleaning with water and organic solvent.SOLUTION: The semiconductor wafer treating method conducts a drying process of blowing gas to a plurality of surfaces of the semiconductor wafer after cleaning the semiconductor wafer. The gas blowing is controlled so as not to make gas from a plurality of directions intersect with each other on the main surface of the semiconductor wafer when blowing gas to the semiconductor wafer in the dry process. The semiconductor wafer drying device for blowing the gas to the plurality of surfaces of the semiconductor wafer includes: a first blowing pipe for blowing the gas from one lateral side of the semiconductor wafer; and a second blowing pipe for blowing the gas from the other lateral side of the semiconductor wafer. At least one of the first blowing pipe and the second blowing pipe blow gas while moving.