| 摘要 |
PROBLEM TO BE SOLVED: To solve such a problem that although a conventional FC packaging type LED is high in emission efficiency, it is difficult to actualize the FC packaging type LED of which the reliability of electrical connection is high when positioning and packaging in flip-chip packaging.SOLUTION: An FC packaging type LED 10 having an n-type nitride semiconductor layer 2 and a p-type nitride semiconductor layer 3 formed on a transparent substrate 1, and an n-side electrode 4 and a p-side electrode 5 formed on the n-type nitride semiconductor layer 2 and the p-type nitride semiconductor layer 3, has on the n-type nitride semiconductor layer 2 and the p-type nitride semiconductor layer 3 an insulating layer 6 which is formed so as to have a penetrating hole in the portion of the n-side electrode 4 and the p-side electrode 5, and two roughly rectangle shape electrodes 7, 8 for external connection formed in parallel on the upper plane of the insulating layer 6, wherein these two electrodes 7, 8 for external connection are configured so as to be connected to the n-side electrode 4 and the p-side electrode 5 through the penetrating hole. |
