ADHESIVE SHEET FOR CONNECTING CIRCUIT MEMBER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an adhesive sheet for connecting a circuit member which satisfies adhesiveness to a semiconductor wafer, grindability of the rear surface of the wafer and embedding property at flip chip bonding all in a high level and to provide a method for manufacturing a semiconductor device.SOLUTION: The adhesive sheet for connecting the circuit member is provided with a support base material and an adhesive layer which is arranged on the support base material and comprises an adhesive composition. The adhesive composition includes: (A) a high-molecular-weight component having a weight-average molecular weight of 100,000 or more; (B) an epoxy resin; (C) a phenol-based epoxy resin curing agent; (D) a radiation polymerizable compound; (E) a photopolymerization initiator; and (F) a hardening accelerator.