METHOD, APPARATUS AND PROGRAM FOR MEASURING NONDESTRUCTIVE SINGLE-CRYSTAL SUBSTRATE STRESS

摘要

PROBLEM TO BE SOLVED: To provide a method, apparatus and program for measuring a warping stress of a semiconductor chip mounted in a package by using an X-ray without destroying the package.SOLUTION: The method includes the steps of: delivering the X-ray to a single-crystal substrate sealed with a package material; detecting the diffracted X-ray from the single-crystal substrate over the package material; and obtaining the stress of the single-crystal substrate by using a result of the detection step.