| 发明名称 |
METHOD FOR FABRICATING ELECTRICAL BONDING PADS ON A WAFER |
| 摘要 |
<p>A method for fabricating electrical bonding pads on the electrical contact areas of a wafer includes producing first blocks made of a solder material, producing second blocks made of a solder material on these first blocks, and passing the blocks through an oven so as to shape the blocks into approximately domed electrical bonding pads.</p> |
| 申请公布号 |
EP2181569(B1) |
申请公布日期 |
2011.01.12 |
| 申请号 |
EP20080774406 |
申请日期 |
2008.06.27 |
| 申请人 |
STMICROELECTRONICS (GRENOBLE) SAS |
发明人 |
COFFY, ROMAIN;SEILLER, JACKY;PROVENT, GIL |
| 分类号 |
H05K3/24;H05K3/34 |
主分类号 |
H05K3/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
