| 摘要 |
<p>Method and system for releasing a component from a thermal release tape, the method comprising: attaching a component or an object to be diced into components, for example a wafer, to the thermal release tape; optionally singulating (cutting) the object into components (dies); applying heat to one of the component and the thermal release tape to reduce adhesive effect between the thermal release tape and the component or to release the component completely from the thermal release tape; and releasing the component by picking up or by dropping.</p> |
