| 摘要 |
A method for forming a stacked integrated circuit package of primary dies on a carrier die, includes forming electrically conductive pillars at connection pads defined on an active face of a carrier wafer incorporating carrier integrated circuits, the electrically conductive pillars providing electrical connections to said carrier integrated circuits; attaching primary dies to the active face of the carrier wafer, each supporting electrically conductive pillars at connection pads defined on an active face of the primary die; encapsulating the active face of the carrier wafer and the primary dies attached thereto in an insulating material; producing a wafer package by removing a thickness of the insulating layer sufficient to expose the electrically conductive pillars; and singulating the carrier wafer to form stacked integrated circuit packages, each package comprising at least one primary die on a carrier die. |
