| 摘要 |
<p>A manufacturing method of manufacturing an electronic device, includes the steps of: applying a thermosetting adhesive (13) on a surface of a base (11) having a conductive pattern (112) formed on a film (111); mounting a circuit chip (12) on the base (11) through the thermosetting adhesive (13); holding the base (11) while pressing a circuit chip side of the base and a film side of the base by a heating apparatus that heats the thermosetting adhesive; giving a tension to the base on which the circuit chip is mounted; and heating the thermosetting adhesive by the heating apparatus to cure the thermosetting adhesive, thereby fixing the circuit chip to the conductive pattern.</p> |
