STRUCTURE OF CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A circuit board and a manufacturing method thereof are provided to increase an electrical function by reducing the thickness of a circuit board and a package size. CONSTITUTION: An insulating protective layer(31) is formed in one side of a support substrate. A plurality of openings are formed on the insulating protective layer in order to expose a part of the support substrate. A circuit structure is formed on the surface of the insulating protective layer and inside the opening. A first dielectric layer is formed in the insulating protective layer and the circuit structure. The opening is formed in the first dielectric layer in order to expose a pattern circuit layer(33). A build-up structure, which includes a plurality of second conductive penetration holes, is formed in the first dielectric layer. The connection pad of the build-up structure is electrically connected to a semiconductor device. The support substrate is removed in order to expose the lower side of the first conductive penetration hole.