摘要 |
<p>A printed circuit board unit includes a printed circuit board (11) including through holes (20) arranged in a grid array on which an integrated circuit (12) is mounted; and a flexible substrate (15) provided on a back side of the printed circuit board, covering the through holes. First lands (36) to which the integrated circuit is connected are formed on a front side of the printed circuit board. Second lands (37) to which the flexible substrate is connected are formed on the back side of the printed circuit board. The first lands and the second lands are connected to first ends and second ends of the through holes, respectively. Third lands (38) are formed on a front side of the flexible substrate so as to face the second lands of the printed circuit board. Fourth lands (39) are formed on a back side of the flexible substrate. The fourth lands are electrically connected to the third lands.</p> |