| 摘要 |
A multimodal integrated circuit (IC) is provided, comprising, first (74) and second (76) semiconductor (SC) devices, and first (78) and second (80) integrated passive devices (IPDs) coupled, respectively, to the first (74) and second (76) SC devices, wherein the first IPD (78) overlies the second SC device (76) and the second IPD (80) overlies the first SC device (74) chosen such that the underlying SC device (74, 76) is not active at the same time as its overlying IPD (80, 78). By placing the IPDs (78, 80) over the SC devices (76, 74) a compact IC layout is obtained. Since the overlying IPD (78, 80) and underlying SC (76, 74) are not active at the same time, undesirable cross-talk (68, 69) between the IPDs (78, 80) and the SC devices (76, 74) is avoided. This arrangement applies to any IC having multiple signal paths (RF1, RF2) where the IPDs (78, 80) of a first path (RF1, RF2) may be placed over the SC devices (76, 74) of a second path (RF2, RF1) not active at the same time. This is especially useful with high frequencies ICs.
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