发明名称 Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method
摘要 There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each of conductive balls on each of the plurality of pads, the plurality of ball mounting through holes being arranged to oppose to the plurality of pads; and a conductive ball supplying unit for moving or removing the conductive balls on the conductive ball mounting mask by sucking an air on an upper surface side of the conductive ball mounting mask. The conductive ball mounting mask includes through portions formed to block passing of the conductive balls.
申请公布号 US7866534(B2) 申请公布日期 2011.01.11
申请号 US20080166673 申请日期 2008.07.02
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 SAKAGUCHI HIDEAKI;IIDA KIYOAKI;HIGASHI MITSUTOSHI
分类号 B23K31/02 主分类号 B23K31/02
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