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发明名称
Method for fabricating a semiconductor package
摘要
A method for fabricating an IC package that includes depositing conductive adhesive bodies on the leads, and then adhering the electrodes of an IC device to the so disposed conductive adhesive bodies.
申请公布号
US7867823(B2)
申请公布日期
2011.01.11
申请号
US20070713893
申请日期
2007.03.05
申请人
INTERNATIONAL RECTIFIER CORPORATION
发明人
HU KUNZHONG;CHEAH CHUAN
分类号
H01L21/00
主分类号
H01L21/00
代理机构
代理人
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