发明名称 Method of manufacturing silicon carbide semiconductor device
摘要 A method of manufacturing an SiC semiconductor device includes the steps of ion implanting a dopant at least in a part of a surface of an SiC single crystal, forming an Si film on the surface of the ion-implanted SiC single crystal, and heating the SiC single crystal on which the Si film is formed to a temperature not less than a melting temperature of the Si film.
申请公布号 US7867882(B2) 申请公布日期 2011.01.11
申请号 US20070444551 申请日期 2007.08.13
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 FUJIKAWA KAZUHIRO;MASUDA TAKEYOSHI
分类号 H01L21/265 主分类号 H01L21/265
代理机构 代理人
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