发明名称 |
Heat dissipation device with U-shaped and S-shaped heat pipes |
摘要 |
A heat dissipation device includes a base for contacting an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, including a first transferring portion thermally engaging with the base and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe includes an evaporation portion thermally engaging with the base and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set.
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申请公布号 |
US7866376(B2) |
申请公布日期 |
2011.01.11 |
申请号 |
US20070926701 |
申请日期 |
2007.10.29 |
申请人 |
FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. |
发明人 |
JIANG LEI;ZHENG DONG-BO;FU MENG;CHEN CHUN-CHI |
分类号 |
F28D15/00;F28F7/00;H01L23/34;H05K7/20 |
主分类号 |
F28D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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